ATTACHMENT LIST: ================ This list shows how to combine a chip-file and a package-file to get an RF-nonlinear description of a Infineon Technologies RF-BJT. For frequencies below 100MHz the package equivalent circuit are not required. Type: Chip: Package Comment: BFG19S T296 SOT223_1 BFG135A T236 SOT223_2 BFG193 T359 SOT223_1 BFG194 T396 SOT223_1 pnp BFG196 T395 SOT223_1 BFG235 T236 SOT223_3 2 chips T236 in parallel BFP81 T251 SOT143_1 BFP93A T259 SOT143_1 BFP136W T239 SOT343_2 BFP180 T301 SOT143_1 BFP180W T301 SOT343_1 BFP181 T349 SOT143_1 BFP181W T349 SOT343_1 BFP182 T341 SOT143_1 BFP182W T341 SOT343_1 BFP183 T351 SOT143_1 BFP183W T351 SOT343_1 BFP193 T359 SOT143_2 BFP193W T359 SOT343_1 BFP194 T396 SOT143_2 pnp BFP196 T395 SOT143_2 BFP196W T395 SOT343_1 BFP280 T302 SOT143_1 BFP280W T302 SOT343_1 BFP405 T501 SOT343_3 SIEGET Grounded emitter BFP420 T502 SOT343_3 SIEGET Grounded emitter BFP450 T503 SOT343_4 SIEGET Grounded emitter BFP490 T504 SCT595 SIEGET Grounded emitter BFP520 T506 SOT343_3 SIEGET Grounded emitter BFQ81 T251 SOT23 BFR92P T89 SOT23 BFR92W T89 SOT323 BFR93A T259 SOT23 BFR93AW T259 SOT323 BFR106 T296 SOT23 BFR180 T301 SOT23 BFR180W T301 SOT323 BFR181 T349 SOT23 BFR181W T349 SOT323 BFR182 T341 SOT23 BFR182W T341 SOT323 BFR183 T351 SOT23 BFR183W T351 SOT323 BFR193 T359 SOT23 BFR193W T359 SOT323 BFR194 T396 SOT23 pnp BFR280 T302 SOT23 BFR280W T302 SOT323 BFS17P T122 SOT23 BFS17S T122 SOT363/SOT363S 2 Chips in one package BFS17W T122 SOT323 BFS480 T302 SOT363/SOT363S 2 Chips in one package BFS481 T349 SOT363/SOT363S 2 Chips in one package BFS482 T341 SOT363/SOT363S 2 Chips in one package BFS483 T351 SOT363/SOT363S 2 Chips in one package BFT92 T389 SOT23 pnp BFT92W T389 SOT323 pnp BFT93 T309 SOT23 pnp Package comments: SOT363 is a complete equivalent circuit of the package including coupling of the two transistors. SOT363S is a simplified equivalent circuit which describes one of the transistors without coupling to the other one. Different package equivalent circuits of one package type describe different internal package layouts or different chip sizes. V 1.4 April 1999